Ultra-Thin Optical Modules: Challenging the Thickness Limits and Innovating Processes in Smartphones

In the smartphone market, being lightweight and slim is a focal point of competition. Consumer demand for portability and aesthetics makes the and weight of phones key selling points. Optical modules, which take up significant space within phones and are functionally important, face challenges in their ultra-thinization, which also drives innovation in manufacturing techniques.

In 2025, manufacturers such as Apple, Samsung, and Xiaomi plan to launch new models withes within 7mm. The iPhone 17 Air, for instance, is expected to set a new record with a thickness of 6.2mm; Samsung S25 Slim, with powerful imaging capabilities, is approximately 6.5mm thick. These slim models pose even higher requirements for the ultra-thinization optical modules.

Traditional optical modules, especially camera modules, have a larger volume to achieve high-pixel and multi-focus functions. The first ultra-thiniscope continuous zoom module developed by Ofilm's Central Research Institute's Precision Camera Technology Institute, with a thickness of only 5.9mm, sets new industry low. It can reduce the thickness of the phone without changing the internal stacking and layout of the phone.

The ultra-thinization of optical modules faces problems. One is the contradiction between optical performance and thickness. To ensure high pixels, high image quality, and good zoom focusing performance, sufficient optical lenses and reasonable structural are needed, but thinning the module will limit the placement of optical elements and the transmission of light. For example, traditional telephoto lenses have longer lens lengths to high zoom ratios, increasing the thickness of the module. The second is the heat dissipation problem. With the improvement of camera pixel and the richness of functions, the heat during operation increases significantly. However, the ultra-thin design reduces the space for heat dissipation, requiring efficient heat dissipation in limited space to avoid a decrease in image and shooting jams. The third is the test of stability and reliability. Thinner modules have a more compact structure, making it more difficult to connect and fix components It is necessary to ensure that they are not affected by vibrations and collisions during daily use.

To overcome these challenges, manufacturing processes are constantly innovating. In lens, high refractive index, low dispersion optical glass or new optical plastics are used, combined with precision grinding and polishing processes, to reduce the size and thickness of lenses improve the performance of the optical system. In terms of module assembly process, advanced pasting and welding technologies precisely assemble components, reducing internal gaps; new packaging materials and can not only protect components but also assist in heat dissipation and enhance stability. In optical design, computer simulation and optimization algorithms are used, adopting folded optical path design, the transmission path of light, and reducing the thickness of the module; and ultra-thin optical guide film technology is applied to the backlight module of the screen, the ultra-thinization of the screen and ensuring display effects.

In the future, the application of ultra-thin optical modules in smartphones will be more extensive and-depth. The thickness of the module is expected to be further reduced, achieving higher pixels, more shooting functions, and better optical performance. Continuous innovation in manufacturing and reduced costs will allow consumers to enjoy lightweight, high-performance smartphones.